Ball Bonding Services
Automatic gold and copper ball bonding with vision alignment, ultra-fine pitch down to 35 µm and multi-tier bonding up to 5 rows.
Fine Pitch Ball Bonding
Our ball bonding process is performed on our automatic K&S IConn Plus machines or our ASM Eagle Aero GoCu machines, with gold or copper wire from 0.7 mil (18 µm) up to 2.0 mil (50.8 µm).
Our advanced wire bonders are fully automated, with pattern recognition vision alignment and programmable focus for multi-die applications. We offer fine pitch and ultra-fine pitch wire bonding down to 35 µm pitch, and multi-tier wire bonding with up to 5 rows.
- Gold or copper wire, 0.7 to 2.0 mil
- Fine and ultra-fine pitch to 35 µm
- Multi-tier bonding, up to 5 rows
- Pattern recognition vision alignment
- Programmable focus for multi-die
- Gold stud bumping and stand-off stitch bonding
Why Ball Bonding
Ball bonding is the most common wire bond method due to its highly flexible process. One of its key advantages is the ability to create custom loop shapes: loops can have multiple bends or kinks, allowing multiple tiers of wires or crossing wires.
Ball Bond
A ball is formed at the tip of the wire and bonded to the pad on the integrated circuit.
Loop
The wire is drawn into a custom loop shape, with multiple bends or kinks where the design needs them.
Stitch Bond
The wedge, or stitch, bond attaches the other end of the wire to the package.
Inspect & Test
Bonds are checked with third optical inspection, wire pull and ball shear testing.
Copper Ball Bonding on ASM Eagle Aero GoCu
Our late-model ASM Eagle Aero GoCu bonders add copper wire bonding to our ball bonding line, a capability few assembly houses in the United States offer.
Late-Model Equipment
ASM Eagle Aero GoCu automatic ball bonders, new additions to our Garnet Valley line.
Copper or Gold
Ball bonding with copper or gold wire from 0.7 mil (18 µm) up to 2.0 mil (50.8 µm).
Why Copper
Copper wire costs less than gold and has higher electrical and thermal conductivity.
Gold Stud Bumping and Stand-Off Stitch Bonding
Typical ball bonding attaches the ball to the pad on the integrated circuit and the wedge, or stitch, bond to the package. Stand-off stitch bonding (SSB) adds a ball bump prior to placing the wire.
Gold Stud Bumping
Gold ball bumps placed on die or wafer, typically used for flip chip assembly.
Stand-Off Stitch Bonding
The SSB process places a ball bump on the chip or the substrate before the standard ball/wedge bond is made.
Reverse & Chip-to-Chip Bonding
SSB allows reverse wire bonding and chip-to-chip wire bonding.
Ball Bonding Specifications
Have a requirement that falls outside the table? Contact us — chances are we can accommodate it.
| Parameter | Specification |
|---|---|
| Wire materials | Gold, copper |
| Wire diameter | 0.7 mil (18 µm) to 2.0 mil (50.8 µm) |
| Minimum pitch | 35 µm (fine and ultra-fine pitch) |
| Multi-tier | Up to 5 rows |
| Alignment | Pattern recognition vision alignment; programmable focus for multi-die |
| Special processes | Gold stud bumping; stand-off stitch bonding (SSB), reverse and chip-to-chip bonding |
| Quality control | Wire pull and ball shear testing in-house; digital third optical inspection (3OI) |
| Equipment | K&S IConn Plus; ASM Eagle Aero GoCu |
Related Services
Wedge Bonding
Fine wire wedge bonding in gold or aluminum, 1.0 to 2.0 mil, on Hesse & Knipps and K&S bonders.
Learn moreHeavy Wire Bonding
Heavy aluminum wedge bonding with 100 to 500 µm wire for power semiconductor and high-voltage devices.
Learn moreChip on Board
Bare die wire bonded directly to your PCB, with guidance on ENIG, soft gold and ENEPIG plating.
Learn moreReady to move your project forward?
From a single wafer to full production runs — our Garnet Valley, PA facility turns your design files into packaged devices.