Open Cavity QFN Packages from Pin 1 Semiconductor
Product

Open Cavity QFN Packages

Open cavity QFN packages expose the die cavity through a pre-molded plastic body, letting you assemble and seal your own devices without waiting 8–12 weeks for custom tooling. We stock a library of common configurations so you can order in single quantities and ship the same week.

  • Pre-molded plastic body with die cavity exposed
  • Lead counts from 8 to 100
  • Body sizes from 3×3 mm to 12×12 mm
  • Cavity depths compatible with 150–500 µm die
  • Compatible with epoxy, solder and eutectic attach
  • Optional lid sealing in-house
Request a quote
Capabilities

Package specifications

Typical parameters. Custom variations are available — contact us with your requirements for a same-day response.

ParameterSpecification
Body sizes3×3, 4×4, 5×5, 7×7, 8×8, 10×10, 12×12 mm
Lead count8 to 100 pins
Lead pitch0.4 mm and 0.5 mm
Cavity materialCu alloy with epoxy body
Lead finishNiPdAu or matte tin
Stock availabilityMost configs in stock, single-piece MOQ

Ready to move your project forward?

From a single wafer to full production runs — our Garnet Valley, PA facility turns your design files into packaged devices.

Request a Quote Explore Products