About Flip Chip Assembly at Pin 1 Semiconductor
Pin 1 Semiconductor provides flip chip assembly services including solder reflow, thermocompression, thermosonic, copper pillar and epoxy attach technologies, with pitch sizes down to 150 microns.
- Solder reflow flip chip
- Thermocompression and thermosonic bonding
- Copper pillar and epoxy attach
- Pitch sizes down to 150 µm
- Placement accuracy to ±5 µm
- Epoxy underfill and mixed flip chip / wire bond builds
Flip Chip Bonding Equipment
Two flip chip bonders cover precision placement and automatic production.
SEC Omni Bonder
Semiconductor Equipment Corp Omni Bonder with ±5 µm placement accuracy. Equipped with a heated stage and an ultrasonic bond head for thermosonic flip chip attach.
ESEC Micron 2
Automatic flip chip bonder with ±12 µm placement accuracy.
Thermosonic Flip Chip and Mixed Technologies
The Omni Bonder's heated stage and ultrasonic bond head enable thermosonic flip chip attach. With the thermosonic approach, we can direct bond gold bumps to gold pads on the substrate.
We can also combine flip chip with other technologies, such as wire bonding of an interposer IC. After flip chip attach, we can underfill with epoxy to provide added strength and reliability.
Flip Chip Assembly Specifications
Have a requirement that falls outside the table? Contact us — chances are we can accommodate it.
| Parameter | Specification |
|---|---|
| Technologies | Solder reflow, thermocompression, thermosonic, copper pillar, epoxy attach |
| Minimum pitch | 150 µm |
| Placement accuracy | ±5 µm (SEC Omni Bonder), ±12 µm (ESEC Micron 2) |
| Thermosonic attach | Gold bumps direct bonded to gold substrate pads |
| Underfill | Epoxy underfill |
| Mixed technology | Flip chip combined with wire bonding (e.g. interposer IC) |
| Equipment | SEC Omni Bonder, ESEC Micron 2 |