Product
BGA Substrates
We have an inventory of in stock BGA Substrates — from low-count PBGA through high-density FCBGA. Substrates are available bare for you to assemble or as part of a turnkey packaging program.
- PBGA, FCBGA, LGA
- Ball counts from 49 to 700
- Fine-line and laser-drilled vias
- Compatible with SnPb and Pb-free reflow
- Turnkey assembly onto customer substrates
Capabilities
Package specifications
| Parameter | Specification |
|---|---|
| Ball count | 49 to 700 |
| Ball pitch | 0.4 mm to 1.27 mm |
| Substrate type | PBGA, CBGA, FCBGA, LGA, interposer |
| Finishes | ENIG, Au flash |
| Assembly | Flip chip and wire bond compatible |
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