Service
IC Assembly Services
Pin1 Semiconductor provides full turnkey IC assembly services for fabless startups, R&D labs, defense primes and established OEMs. Drop off a wafer — or ship us diced die — and we handle every step through to marked, packaged devices.
- Bare wafer or pre-diced die input
- Epoxy, solder and eutectic die-attach
- Gold ball & aluminum wedge wire bonding
- Transfer molding and glob-top encapsulation
- Ink marking & final visual inspection
- Lot-level traceability and SPC
Capabilities
Process specifications
A snapshot of the parameters our ic assembly services line supports. Have a requirement that falls outside the table? Contact us — chances are we can accommodate it.
| Parameter | Specification |
|---|---|
| Input material | Bare wafers up to 300 mm, diced die, gel-pak or waffle-pack |
| Die attach | Epoxy, solder, eutectic AuSn, sintered silver |
| Wire bonding | 25 µm gold ball, 1-mil aluminum wedge, 75–500 µm heavy Al wedge |
| Minimum pitch | 35 µm (fine-pitch gold ball) |
| Package types | Open-cavity QFN / QFP / SOIC, ceramic, BGA, COB |
| Turnaround | 8 business hours (same-day available on request) |
| Minimum lot | 1 piece |
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