Product
Open Cavity QFP Packages
Open cavity LQFP packages are a favorite for CMOS image sensors, MEMS devices and any project that needs an optical window or post-assembly lid sealing. We stock the most common QFP and LQFP bodies and can integrate lid attach as part of your assembly flow.
- Pre-molded LQFP and TQFP bodies
- Lead counts from 32 to 208 pins
- Body sizes from 7×7 mm to 28×28 mm
- Compatible with glass or metal lid seal
- Suitable for MEMS, CMOS sensors and optical devices
- Gold or NiPdAu lead finishes
Capabilities
Package specifications
Typical parameters. Custom variations are available — contact us with your requirements for a same-day response.
| Parameter | Specification |
|---|---|
| Body sizes | 7×7, 10×10, 14×14, 20×20, 28×28 mm |
| Lead count | 32 to 208 pins |
| Lead pitch | 0.4 mm, 0.5 mm, 0.65 mm |
| Lead finish | NiPdAu or gold flash |
| Lid seal | Glass, metal or ceramic lids available |
| Stock availability | Common sizes in stock; custom on request |
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