Heavy Wire Bonding Services
Heavy aluminum wedge bonding from 100 to 500 µm wire for power semiconductor and high-voltage applications.
Heavy Aluminum Wedge Bonding
Pin 1 Semiconductor offers heavy aluminum wedge bonding for aluminum wire ranging from 100 to 500 µm in diameter. We use an Orthodyne model 360B wire bonder, capable of automatic or semi-automatic bonding.
Heavy wire applications are typically power semiconductor or high-voltage devices, where larger-diameter wire carries more current than fine wire.
- Aluminum wire, 100 to 500 µm
- Approximately 4 to 20 mil
- Orthodyne 360B bonder
- Automatic or semi-automatic bonding
- Power semiconductor and high-voltage devices
- Wire pull testing in-house
Built for Power Devices
Heavy aluminum wire is the standard interconnect where current and voltage are high.
Power Semiconductors
Heavy wire interconnects for power semiconductor devices.
High-Voltage Devices
Large-diameter aluminum wire for high-voltage applications.
Automatic or Semi-Automatic
The Orthodyne 360B runs automatic production or semi-automatic prototype work.
Heavy Wire Bonding Specifications
Have a requirement that falls outside the table? Contact us — chances are we can accommodate it.
| Parameter | Specification |
|---|---|
| Wire material | Aluminum |
| Wire diameter | 100 µm to 500 µm (approximately 4 to 20 mil) |
| Bond type | Wedge |
| Operation | Automatic or semi-automatic |
| Applications | Power semiconductors, high-voltage devices |
| Quality control | Wire pull testing in-house |
| Equipment | Orthodyne 360B |
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