Custom Package Development
Custom plastic molded and open-cavity QFN packages, designed and tooled in-house in Garnet Valley, Pennsylvania, with wettable flank, exposed thermal paddle and unlidded test parts.
Custom IC Package Design and Tooling
When a standard package doesn’t fit your die, pin count or thermal requirements, Pin 1 Semiconductor designs a custom package around your device. We design and tool custom plastic molded QFN and open-cavity QFN/QFP packages in-house in Garnet Valley, Pennsylvania, and provide the package drawings for your approval.
Because we also dice, die attach and wire bond in the same facility, your custom package goes from drawing to assembled, delivered parts under one roof.
- Custom plastic molded QFN packages
- Custom open-cavity QFN and QFP packages
- Wettable-flank QFN leads
- Exposed center thermal paddle
- Package design drawings, in-house
- Unlidded parts for radiation and other testing
From Die to Delivered Package
Package design, tooling and assembly are all handled in-house.
Review
Send us your die size, pad layout, pin count and thermal and board requirements.
Design
We design the custom package and provide package drawings for your approval.
Tooling
We tool the custom package in-house.
Assemble & Deliver
Your die are attached, wire bonded and molded or lidded in our facility, and packaged parts are delivered.
Custom Package Options
Common requirements we design into custom QFN packages.
Wettable Flank
Wettable-flank leads let solder form a visible fillet on the side of the QFN lead, so solder joints can be checked by automated optical inspection.
Exposed Thermal Paddle
A center metal paddle under the die is soldered to the board to carry heat away from the device.
Unlidded Test Parts
Open-cavity parts can be delivered without a lid for radiation testing and other die-level evaluation.
Package Drawings
We produce the package design drawings in-house and review them with you before tooling.
Plastic Molded or Open Cavity?
Both package styles can be custom designed and tooled in-house.
| Plastic molded QFN | Open-cavity QFN / QFP | |
|---|---|---|
| How the die is protected | Fully encapsulated by transfer molding | Die sits in an open cavity, sealed with a lid or left open |
| Best fit | Low-cost option for higher volumes | Prototype and small-volume builds, and parts that need die access |
| Unlidded test parts | Not applicable | Yes, for radiation testing and other evaluation |
| Wettable flank | Available | Available |
| Exposed thermal paddle | Available | Available |
| Design and tooling | In-house | In-house |
What to Send for a Custom Package Quote
For a rough order of magnitude cost and schedule estimate, include as much of the following as you have. Email it to info@pin1semi.com or use our contact form.
Die Details
Die size and thickness, wafer size, and pad layout or bond diagram.
Package Target
Plastic molded or open cavity, body size, pin count, wettable flank and thermal paddle requirements.
Quantities & Testing
Prototype and production quantities, the application, and any testing needs such as unlidded parts for radiation testing.
Related Products & Services
Overmolded QFN Packages
Transfer molded QFN packages, with 4 × 4, 5 × 5 and 7 × 7 mm sizes available immediately.
Learn moreOpen Cavity QFN
Open cavity QFN packages for prototype and small-volume assembly.
Learn moreWire Bonding
Gold, copper and aluminum wire bonding, with fine pitch ball bonding down to 35 µm.
Learn moreCustom Package FAQ
Can you design a custom QFN package?
Yes. We design and tool custom plastic molded QFN and open-cavity QFN/QFP packages in-house in Garnet Valley, Pennsylvania, and provide the package drawings for your approval.
Do you offer wettable-flank QFN packages?
Yes. Custom QFN packages can be designed with wettable-flank leads, so solder joints can be checked by automated optical inspection.
Can a custom package include an exposed thermal paddle?
Yes. We can design in a center metal paddle under the die for heat dissipation.
Can you supply unlidded parts for radiation testing?
Yes. Open-cavity packages can be delivered without a lid for radiation testing and other die-level evaluation.
What do you need for a rough order of magnitude quote?
Send the die size and thickness, wafer size, pad layout or bond diagram, the package style (plastic molded or open cavity), body size and pin count, wettable flank and thermal paddle requirements, quantities, and any testing needs. Email info@pin1semi.com.
Who assembles the parts once the package is tooled?
We do. Wafer dicing, die attach, wire bonding and molding or lidding are all done in our Garnet Valley, PA facility.
Ready to move your project forward?
From a single wafer to full production runs — our Garnet Valley, PA facility turns your design files into packaged devices.