Product
Ceramic Packages
When your device has to survive temperature extremes, radiation or salt fog for decades, a hermetic ceramic package is the answer. Pin1 Semiconductor assembles into CLCC, CQFP, CERDIP and PGA ceramic bodies with gold wire bonding and seam-seal or solder-seal lidding.
- CLCC, CQFP, CERDIP, PGA package support
- Gold wire bonding in ceramic cavities
- Seam-seal, solder-seal and glass-frit sealing
- Fine and gross leak tested
- Compatible with AuSn eutectic die attach
- Hi-rel and space-grade materials
Capabilities
Package specifications
Typical parameters. Custom variations are available — contact us with your requirements for a same-day response.
| Parameter | Specification |
|---|---|
| Package types | CLCC, CQFP, CERDIP, PGA, ceramic BGA |
| Sealing | Seam weld, solder seal, glass frit |
| Lid material | Kovar, ceramic, glass |
| Leak test | Fine leak + gross leak (MIL-STD-883) |
| Die attach | AuSn eutectic, Ag-epoxy, Ag sintered |
| Qualifications | MIL-STD-883 process compatible |
Explore more