Wire Bonding at Pin 1 Semiconductor
Pin 1 Semiconductor offers wire bonding capabilities for a variety of applications, including the following processes.
All wire bonding is done in-house at our Garnet Valley, PA facility, with wire pull and ball shear testing on site.
- Fine pitch ball bonding
- Copper wire bonding
- Fine wire wedge bonding
- Heavy wire wedge bonding
- Gold stud bumping
- Chip on board wire bonding
Wire Bonding Processes
Choose a process to see equipment, wire sizes and specifications.
Ball Bonding
Gold and copper ball bonding from 0.7 to 2.0 mil wire, ultra-fine pitch down to 35 µm and multi-tier bonding up to 5 rows.
Learn moreCopper Wire Bonding
Copper ball bonding on late-model ASM Eagle Aero GoCu bonders, a capability few U.S. assembly houses offer.
Learn moreWedge Bonding
Fine wire wedge bonding in gold or aluminum, 1.0 to 2.0 mil, on Hesse & Knipps and K&S bonders.
Learn moreHeavy Wire Bonding
Heavy aluminum wedge bonding with 100 to 500 µm wire for power semiconductor and high-voltage devices.
Learn moreGold Stud Bumping
Ball bumps placed on die or wafer, typically used for flip chip assembly.
Learn moreChip on Board
Bare die wire bonded directly to your PCB, with guidance on ENIG, soft gold and ENEPIG plating.
Learn moreCopper Wire Bonding, In-House
Pin 1 Semiconductor has added ASM Eagle Aero GoCu wire bonders, late-model machines with copper wire bonding capability. Copper wire bonding is a capability few assembly houses in the United States offer.
Late-Model ASM Equipment
ASM Eagle Aero GoCu automatic ball bonders, new additions to our Garnet Valley line.
0.7 to 2.0 mil Wire
Copper or gold ball bonding with wire from 0.7 mil (18 µm) up to 2.0 mil (50.8 µm).
Why Copper
Copper wire costs less than gold and has higher electrical and thermal conductivity.
Our Wire Bonding Equipment
Each bonder in our suite offers unique capabilities, giving you the flexibility to match the machine to your application.
| Manufacturer | Model | Process | Wire |
|---|---|---|---|
| K&S | IConn Plus | Automatic ball bonding | Gold |
| ASM | Eagle Aero GoCu | Automatic ball bonding | Copper or gold |
| Hesse & Knipps | BJ815 | Wedge bonding | Gold or aluminum |
| K&S | 8060 | Wedge bonding | Gold or aluminum |
| Orthodyne | 360B | Heavy wire wedge bonding, automatic or semi-automatic | Aluminum, 100–500 µm |
Wire Bond Quality Control
Pin 1 Semiconductor has in-house equipment to test wire pull strength and ball shear strength, along with CAD import and export and digital third optical inspection.
Wire Pull Testing
In-house wire pull strength testing to verify bond quality.
Ball Shear Testing
In-house ball shear strength testing on ball bonded devices.
CAD Import & Export
We work directly from your design files, with CAD import and export capability.
Third Optical Inspection (3OI)
Digital 3OI compares the taught wire bond program against your design file, to ensure there are no errors in the bonded device.
Wire Bonding FAQ
What wire bonding services do you offer?
We offer gold and copper ball bonding, fine wire wedge bonding in gold or aluminum, heavy aluminum wedge bonding, gold stud bumping and chip-on-board wire bonding, all in-house in Garnet Valley, Pennsylvania.
Do you offer copper wire bonding?
Yes. Our ASM Eagle Aero GoCu bonders are late-model machines with copper wire bonding capability, which few assembly houses in the United States offer. They also bond gold wire.
What is your finest wire bond pitch?
We offer fine pitch and ultra-fine pitch ball bonding down to 35 µm, and multi-tier wire bonding with up to 5 rows.
What wire diameters can you bond?
Ball bonding uses gold or copper wire from 0.7 mil (18 µm) to 2.0 mil (50.8 µm). Wedge bonding uses gold or aluminum wire from 1.0 to 2.0 mil (25.4 to 50.8 µm). Heavy wire bonding uses aluminum wire from 100 to 500 µm.
How do you verify wire bond quality?
We test wire pull strength and ball shear strength in-house, and use digital third optical inspection (3OI) to compare the bond program against your design file.
Related Services
IC Assembly
Turnkey IC assembly for prototype and small-volume semiconductor packaging.
Learn moreDie Bonding
Epoxy, solder and eutectic die-attach for demanding thermal and electrical paths.
Learn moreFlip Chip Assembly
Solder reflow, thermocompression, thermosonic and copper pillar flip chip, with ±5 µm placement.
Learn more