Service
BGA Assembly
Pin1 Semiconductor offers BGA assembly and re-balling as a stand-alone service or as part of a turnkey IC packaging flow. We support SnPb, Pb-free and mixed-alloy re-balling with full X-ray inspection for void analysis and joint integrity.
- BGA re-balling (Sn63/Pb37 and Pb-free)
- BGA rework on PCBs and modules
- X-ray inspection for void analysis
- Substrates from 1 mm to 55 mm
- Plastic and ceramic BGA support
- Lead conversion programs
Capabilities
Process specifications
A snapshot of the parameters our bga assembly line supports. Have a requirement that falls outside the table? Contact us — chances are we can accommodate it.
| Parameter | Specification |
|---|---|
| Ball pitch | 0.5 mm and up |
| Ball alloys | Sn63/Pb37, SAC305, SnAg |
| Substrate sizes | 1 mm up to 55 mm |
| BGA types | PBGA, CBGA, CCGA, FCBGA |
| Inspection | Real-time X-ray, AOI, C-SAM |
| Rework | Site-specific with thermal profiling |
| Qualification | IPC-7095 compatible |
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