Product
Package Lids & Seals
Every cavity package needs a lid. Pin1 Semiconductor stocks, alumina, aluminum and glass lids in the most common sizes and seals them with adhesive attach — matched to the material requirements of your device.
- Alumina, and Glass Lids
- Adhesive attach
- Optical-grade glass lids available
- Custom lid fabrication on request
- Full lid library for stock open-cavity packages
Capabilities
Package specifications
Custom variations are available — contact us with your requirements.
| Parameter | Specification |
|---|---|
| Materials | Alumina Al₂O₃, Al, glass, sapphire |
| Sealing methods | Seam weld, solder seal, adhesive, glass frit |
| Sizes | 3×3 mm to 40×40 mm |
| Stock availability | Common sizes for in-house OC packages |
| Custom | Custom lid sourcing and fabrication |
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